Engineering Professor
IEEE Fellow, OSA Fellow, and SPIE Fellow
Rochester Institute of Technology
Rochester, New York
Expertise
Semiconductor IC fabrication
Silicon processing
Microlithography and patterning
LCD and flat panel processes
Thin film transistor (TFT) processes
Thin films and deposition methods
Plasma RIE and etching
Wafer and substrate processing
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Bruce Smith has over 30 years of research, academic, industry, and consulting engineering experience in IC (integrated circuit) processing, semiconductor device materials, microelectronics, microlithography, and LCD-TFT (thin film transistor) technology. He is a professor of Microelectronic Engineering and the Director of the Ph.D. program in Microsystems Engineering at the Rochester Institute of Technology. His industry experience includes manufacturing and R&D and he has worked with companies in the US, Europe, and Asia. Professor Smith is a Fellow of the IEEE, a Fellow of the OSA, a Fellow of SPIE, and a member of AVS, ASEE, and SID. He is the recipient of RIT’s Trustees Scholarship Award, a SPIE Research Mentoring Award, RIT’s Creators Award, and the Rush Henrietta Outstanding Alumni Award, among others, and has been inducted into RIT’s Innovator Hall of Fame. Professor Smith has over 200 publications including technical papers, articles, textbooks, and textbook chapters. He holds 27 patents and has licensed his technology both nationally and internationally. Prof. Smith has expertise and is able to serve as an expert witness in semiconductor IC processes and fabrication, microlithography, thin films and etch processes, and TFT/LCD flat panel technology.
Professor Smith has expertise and is able to serve as an expert witness in semiconductor IC processes and fabrication, microlithography, deposition, metallization, etch, TFTs, and LCD flat panel technology. He has extensive experience as a testifying expert in a variety of patent matters including the ITC, Federal District courts, PTO re-examination hearings, Markman hearings, and IPR petitions.