Bruce Smith has been a Professor at the Rochester Institute of Technology for over 30 years, teaching and carrying out research in fields of IC processing, semiconductor device materials, microelectronics, microlithography, and display technology. Since 1988, he has also been deeply involved in semiconductor device research, development, and manufacturing with various semiconductor companies and research consortiums.
Employment History
Rochester Institute of Technology, Engineering Professor, 1988-present
- Director/Professor, Microsystems Engineering Ph.D. Program, 2008-present
- Intel Professor, Microelectronic Engineering, 2000-2007
- Associate Graduate Dean, Kate Gleason College of Engineering, 2001-2004
- Director, Center for Nanolithography Research, 2004-present
- Professor, Microelectronic Engineering Department, 1988-present
1998 to 2013 - President & CEO, LTC dba Amphibian Systems (Rochester, NY)
Manufacturer of specialty equipment for semiconductor, nanophotonic, and patterned hard disk drive applications, specializing in nanopatterning systems and metrology. Producer of excimer laser wafer exposure systems based on patented technology and cross licensing with major equipment supply companies. Customer base includes major chip and materials suppliers in the US and Asia.
2001 and 2008 - Visiting Professor, IMEC Micro and Nanoelectronics Research Center (Leuven, Belgium)
Member of research and development team at world-leading independent research center in nanoelectronics and nanotechnology. Developed patterning approaches for next-generation semiconductor scaling in sub-90nm and sub-45nm device generations.
1997 - Visiting Scholar, International SEMATECH (Austin, TX)
Microlithography research and development and next-generation process development at world’s largest consortium of semiconductor device manufacturing companies.
1995 - Visiting Scientist, Rutherford Appleton Laboratories (Oxford, UK)
Interfaced with the Space Science and Technology Department and an excimer laser integration group (Exitech) to develop an ArF excimer laser system for sub-250nm patterning including innovation in silylation dry etch pattern transfer
1986 to 1988 - Development Engineer, Advanced Development Center, Digital Equipment Corporation (Hudson, MA)
Integrated circuit R&D and manufacturing with responsibilities in optical and electron beam lithography, thin film sputtering, plasma reactive ion etching, wafer and substrate cleaning, advanced process control, laser based inspection, and optical metrology
1983 to 1986 - Manufacturing Engineer, Process Development Group, Gould AMI Semiconductor (Santa Clara, CA)
Engineering and development in pattern generation, vapor phase CVD for molybdenum / chromium mask repair, laser based CD and overlay metrology, design to design/database defect inspection, manufacturing process flow